Chemical vapor deposition of cobalt nitride and its application as an adhesion-enhancing layer for advanced copper interconnects

ECS Journal of Solid State Science and Technology

Volumn 1, Issue 5, 2012, Pages

  Bhandari, Harish B ^a,b   Yang, Jing ^a   Kim, Hoon ^a,c   Lin, Youbo ^a,d   Gordon, Roy G ^a   Wang, Qing Min ^e   Lehn, Jean Sébastien M ^e   Li, Huazhi ^e   Shenaie, Deo ^e  

^a HARVARD UNIVERSITY   (United States)

^b RADIATION MONITORING DEVICES INC   (United States)

^c Albany Nanotech   (United States)

^d IBM   (United States)

^e DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84880982160     PISSN: 21628769     EISSN: 21628777     Source Type: Journal    
DOI: 10.1149/2.005205jss     Document Type: Article

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