Regression methods for virtual metrology of layer thickness in chemical vapor deposition

IEEE/ASME Transactions on Mechatronics

Volumn 19, Issue 1, 2014, Pages 1-8

  Purwins, Hendrik ^a,b,c   Barak, Bernd ^d   Nagi, Ahmed ^b,e,f   Engel, Reiner ^d   Hockele, Uwe ^d   Kyek, Andreas ^d   Cherla, Srikanth ^b,e,g   Lenz, Benjamin ^d   Pfeifer, Gunter ^d   Weinzierl, Kurt ^d  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b PMC Technologies GmbH   (Germany)

^c AALBORG UNIVERSITY   (Denmark)

^d INFINEON TECHNOLOGIES AG   (Germany)

^e UNIVERSITAT POMPEU FABRA   (Spain)

^f R2 Financial Technologies   (Canada)

^g CITY UNIVERSITY   (United Kingdom)

Author keywords

Regression analysis; semiconductor device measurement; silicon semiconductors; virtual metrology

Indexed keywords

EID: 84895060118     PISSN: 10834435     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMECH.2013.2273435     Document Type: Article

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