A novel virtual metrology scheme for predicting CVD thickness in semiconductor manufacturing

IEEE/ASME Transactions on Mechatronics

Volumn 12, Issue 3, 2007, Pages 308-316

  Hung, Min Hsiung ^a   Lin, Tung Ho ^b   Cheng, Fan Tien ^b   Lin, Rung Chuan ^b  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Chemical vapor deposition (CVD); Model parameter coordinator (MPC); Radial basis function neural network (RBFN); Virtual metrology (VM)

Indexed keywords

BACKPROPAGATION; MATHEMATICAL MODELS; PRODUCTION; RADIAL BASIS FUNCTION NETWORKS; SEMICONDUCTOR DEVICE MANUFACTURE; WAFER BONDING;

MODEL PARAMETER COORDINATOR (MPC); PRODUCTION EQUIPMENT; SEMICONDUCTOR MANUFACTURING; VIRTUAL METROLOGY MODEL; VIRTUAL METROLOGY SCHEME (VMS);

CHEMICAL VAPOR DEPOSITION;

EID: 34347398446     PISSN: 10834435     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMECH.2007.897275     Document Type: Article

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