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Journal of Materials Science: Materials in Electronics

Volumn 25, Issue 3, 2014, Pages 1446-1455

The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy

(2) Sona, Mrunali a Prabhu, K Narayan a

a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA (India)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84894655667 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-014-1749-x Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.