Interfacial reaction and mechanical reliability of eutectic Sn-0̇7Cu/immersion Ag-plated Cu solder joint

Materials Science and Technology

Volumn 25, Issue 12, 2009, Pages 1478-1484

  Yoon, J W ^a   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball shear test; Ball gird array (bga); Eutectic sn cu solder; Immersion ag plating; Interfacial reaction; Joint reliability

Indexed keywords

AGING TREATMENT; BALL SHEAR TEST; CU LAYERS; CU SUBSTRATE; EUTECTIC PHASE; EUTECTIC REACTIONS; IMC LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; JOINT RELIABILITY; MECHANICAL RELIABILITY; MOLTEN SOLDERS; PLATING LAYER; SHEAR TESTS; SN-CU SOLDERS; SOLDER JOINTS; SOLDER MATRIX;

BRITTLE FRACTURE; DISSOLUTION; ELECTRIC CURRENTS; EUTECTICS; FAILURE ANALYSIS; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SPHERES; TIN ALLOYS;

TIN;

EID: 71649113296     PISSN: 02670836     EISSN: 17432847     Source Type: Journal    
DOI: 10.1179/174328408X374739     Document Type: Article

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