System-level thermal modeling for 3D circuits: Characterization with a 65nm memory-on-logic circuit

2013 IEEE International 3D Systems Integration Conference, 3DIC 2013

Volumn , Issue , 2013, Pages

  Santos, Cristiano ^a,c   Vivet, Pascal ^a   Dutoit, Denis ^a   Garrault, Philippe ^b   Peltier, Nicolas ^b   Reis, Ricardo ^c  

^a CEA LETI   (France)

^b DOCEA Power   (France)

^c FEDERAL UNIVERSITY OF RIO GRANDE DO SUL   (Brazil)

Author keywords

3DIC; characterization; CTM; material homogenization; temperature; thermal modeling

Indexed keywords

EID: 84893966264     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2013.6702379     Document Type: Conference Paper

References (15)

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