Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices - Technology directions

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Volumn , Issue , 2011, Pages

  Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; 3D STACKING TECHNOLOGY; 3D TECHNOLOGY; ADVANCED CMOS DEVICE; CIRCUIT BEHAVIORS; MECHANICAL IMPACTS; ROADMAP; THERMAL INTERACTION; THROUGH-SILICON-VIA;

CMOS INTEGRATED CIRCUITS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 84866864678     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2012.6262977     Document Type: Conference Paper

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