Compact nonlinear thermal modeling of packaged integrated systems

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn , Issue , 2013, Pages 157-162

  Liu, Zao ^a   Tan, Sheldon X D ^a   Wang, Hai ^b   Swarup, Sahana ^a   Gupta, Ashish ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA   (China)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLICATED SYSTEMS; LINEAR LOCAL MODELS; LINEAR TRANSFORMATION METHOD; NONLINEAR MODELING; NONLINEAR THERMAL MODELING; PIECEWISE LINEAR MODELS; SUBSPACE IDENTIFICATION METHODS; TEMPERATURE-DEPENDENT PROPERTIES;

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; INTEGRATED CONTROL; PIECEWISE LINEAR TECHNIQUES; THERMOANALYSIS;

MATHEMATICAL TRANSFORMATIONS;

EID: 84877782273     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2013.6509589     Document Type: Conference Paper

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