Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer

Solar Energy Materials and Solar Cells

Volumn 123, Issue , 2014, Pages 139-143

  Yang, T L ^a   Huang, K Y ^a   Yang, S ^a   Hsieh, H H ^b   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Activation energy; Crystalline silicon solar cell; Intermetallic compounds; Reliability

Indexed keywords

ACCELERATED TESTS; APPARENT ACTIVATION ENERGY; CRYSTALLINE SILICON SOLAR CELLS; DIFFUSION-CONTROLLED PROCESS; METALLIZATION LAYERS; SERIES RESISTANCES; SOLID-STATE AGING; STORAGE TEMPERATURES;

ACTIVATION ENERGY; DIGITAL STORAGE; ELECTRIC RESISTANCE; GROWTH KINETICS; INTERMETALLICS; KINETICS; LEAD; METALLIZING; PHOTOVOLTAIC CELLS; RELIABILITY; SILICON SOLAR CELLS; SILVER; SILVER ALLOYS; SINTERING; SOLDERING ALLOYS;

TIN;

EID: 84893295126     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2014.01.018     Document Type: Article

References (23)

1. H.H. Hsieh, F.M. Lin, F.Y. Yeh, and M.H. Lin The effects of temperature and solder on the wettability between ribbon and solar cell Sol. Energy Mater. Sol. Cells 93 2009 864 868
2. S. Schindler, S. Wiese, Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections, in: Proceedings of the 3rd Electronic System-Integration Technology Conference (ESTC), (2010), pp. 1-5.
3. J. Moyer, W. Zhang, Solder wetting measurement of back contact paste using a wetting balance, in: Proceedings of the 34th Photovoltaic Specialists Conference (PVSC), (2009), pp. 1838-1841.
4. G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, and J. Loman Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells Prog. Photovolt.: Res. Appl. 18 2010 162 182
5. A.M. Gabor, M. Ralli, S. Montminy, L. Alegria, C. Bordonaro, J. Woods, L. Felton, Soldering induced damage to thin Si solar cells and detection of cracked cells in modules, in: Proceedings of the 21st European Photovoltaic Solar Energy Conference, (2006).
6. J.S. Jeong, N. Park, and C. Han Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module Microelectron. Reliab. 52 2012 2326 2330
7. S. Wiese, F. Kraemer, N. Betzl, D. Wald, Interconnection technologies for photovoltaic modules-analysis of technological and mechanical problems, in: Proceedings of the 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, (2010), pp. 1-6.
8. S. Nieland, M. Baehr, A. Boettger, A. Ostman, and H. Reichi, Advantages of microelectronic packaging for low temperature lead free soldering of thin solar cells, in: Proceedings of the 22nd European Photovoltaic Solar Energy Conference, (2007).
9. J. Wendt, M. Träger, M. Mette, A. Pfennig, B. Jäckel, The link between mechanical stress induced by soldering and micro damages in silicon solar cells, in: Proceedings of the 24th European Photovoltaic Solar Energy Conference, (2009).
10. K.S. Kim, S.H. Huh, and K. Suganuma Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints J. Alloys Compd. 352 2003 226 236
11. L.C. Shiau, C.E. Ho, and C.R. Kao Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages Solder. Surf. Mt. Technol. 14 2002 25 29
12. G. Ghosh Interfacial reaction between multicomponent lead-free solders and Ag, Cu, Ni, and Pd substrates J. Electron. Mater. 33 2004 1080 1091
13. K.N. Tu Cu/Sn interfacial reactions: thin-film case versus bulk case Mater. Chem. Phys. 46 1996 217 223 (Pubitemid 126364954)
14. C.E. Ho, S.C. Yang, and C.R. Kao Interfacial reaction issues for lead-free electronic solders J. Mater. Sci.: Mater. Electron. 18 2007 155 174 (Pubitemid 44963683)
15. W.C. Luo, C.E. Ho, J.Y. Tsai, Y.L. Lin, and C.R. Kao Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Mater. Sci. Eng. A 396 2005 385 391 (Pubitemid 40440663)
16. C.E. Ho, W.T. Chen, and C.R. Kao Interactions between solder and metallization during long-term aging advanced microelectronic packages J. Electron. Mater. 30 2001 379 385 (Pubitemid 32432798)
17. S.J. Wang, and C.Y. Liu Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure J. Electron. Mater. 32 2003 1303 1309
18. S.W. Chen, and Y.W. Yen Interfacial reactions in Ag-Sn/Cu couples J. Electron. Mater. 28 1999 1203 1208
19. 3Sn coarsening and its effects on creep in Sn-Ag-Cu solder J. Acta Metall. Sin. 45 2009 912 918
20. L.J. Caballero, P. Sánchez-Friera, B. Lalaguna, J. Alonso, M.A. Vázquez, Series resistance modelling of industrial screen-printed monocrystalline silicon solar cells and modules including the effect of spot soldering, in: Proceedings of the 4th World Conference on Photovoltaic Energy Conversion, (2006), pp. 1388-1391.
21. H.H. Hsieh, F.M. Lin, and S.P. Yu Performance of low series-resistance interconnections on the polycrystalline solar cells Sol. Energy Mater. Sol. Cells 95 2011 39 44
22. Y. Yan, G. Wang, K. Song, and K. Zhao Effect of Ag particles on wettability and creep rupture life of SnCu based composite solders Mater. Sci. Forum 650 2010 78 84
23. R. Pandher, T. Lawlor, Effect of silver in common lead-free alloys, in: Proceedings of International Conference on Soldering and Reliability, (2009).