Investigation of wettability and interface reactions of Sn-Pb, Sn-Cu, Sn-Ag and Sn-Ag-Cu solders for solar cell interconnections

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Schindler, Sebastian ^a   Wiese, Steffen ^b  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

^b SAARLAND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CELL INTERCONNECTION; CRYSTALLINE SOLAR CELLS; ENVIRONMENT FRIENDLY; INTERFACE REACTIONS; KEY PARAMETERS; LEAD FREE SOLDERS; MICROSTRUCTURAL PROPERTIES; PHOTOVOLTAIC APPLICATIONS; PHOTOVOLTAIC MODULES; SILICON-BASED; SNAGCU SOLDER; SOLDERING PROCESS; WETTING BEHAVIOUR;

BIOMECHANICS; LEAD; MECHANICAL PROPERTIES; PHOTOVOLTAIC EFFECTS; SOLAR CELLS; SOLAR POWER GENERATION; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; WETTING;

TIN;

EID: 78651345165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642904     Document Type: Conference Paper

References (9)

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