Effect of Ag particles on wettability and creep rupture life of SnCu based composite solders

Materials Science Forum

Volumn 650, Issue , 2010, Pages 78-84

  Yan, Yanfu ^a   Wang, Guoxin ^b   Song, Kexing ^a   Zhao, Kuaile ^a  

^a Henan Key Laboratory of Advanced Non Ferrous Metals   (China)

^b HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Ag particles; Composite solders; Creep rupture life; SnCu eutectic alloy; Wittability

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; CREEP; EUTECTICS; SILVER; TIN ALLOYS; WETTING;

AG PARTICLES; COMPOSITE SOLDERS; CREEP RUPTURE LIFE; EUTECTIC ALLOYS; WITTABILITY;

LEAD-FREE SOLDERS;

EID: 77955449359     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.650.78     Document Type: Conference Paper

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