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Volumn 95, Issue 1, 2011, Pages 39-44

Performance of low series-resistance interconnections on the polycrystalline solar cells

Author keywords

High conductivity; Photovoltaic ribbon; Series resistance (Rs)

Indexed keywords

BEFORE AND AFTER; ELECTRICAL PERFORMANCE; HIGH FILL FACTORS; HIGH-CONDUCTIVITY; LEAD-FREE; LOW POWER LOSS; MICROSTRUCTURE ANALYSIS; OUTPUT POWER; PATTERNED STRUCTURE; PHOTOVOLTAIC RIBBON; POLYCRYSTALLINE SOLAR CELLS; POWER-LOSSES; PV MODULES; SERIES RESISTANCES; SERIES-RESISTANCE (RS); SHUNT RESISTANCES; SOLDER MATERIAL; SOLDERING PROCESS;

EID: 78149362512     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2010.04.034     Document Type: Conference Paper
Times cited : (18)

References (18)
  • 2
    • 0026938523 scopus 로고
    • Constant strain rate tensile properties of various lead based solder alloys at 0, 50 and 100 °c
    • M. Cole, and T. Caulfield Constant strain rate tensile properties of various lead based solder alloys at 0, 50 and 100 °C Scr. Metall. Mater. 27 1992 903 908
    • (1992) Scr. Metall. Mater. , vol.27 , pp. 903-908
    • Cole, M.1    Caulfield, T.2
  • 3
    • 0029389630 scopus 로고
    • The role of CuSn intermetallics in wettability degradation
    • H.L. Reynolds, and J.W. Morris Jr. The role of CuSn intermetallics in wettability degradation J. Eletron. Mater. 24 10 1995 1429 1434
    • (1995) J. Eletron. Mater. , vol.24 , Issue.10 , pp. 1429-1434
    • Reynolds, H.L.1    Morris Jr., J.W.2
  • 4
    • 51649132316 scopus 로고
    • Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
    • D.R. Frear, and P.T. Vianco Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys Metall. Mater. Trans. 25A 1994 1509 1523
    • (1994) Metall. Mater. Trans. , vol.25 , pp. 1509-1523
    • Frear, D.R.1    Vianco, P.T.2
  • 6
    • 0033747819 scopus 로고    scopus 로고
    • Lead-free solders in microelectronics
    • M. Abtew, and G. Selvaduray Lead-free solders in microelectronics Mater. Sci. Eng. Rep. 27 2000 95 141
    • (2000) Mater. Sci. Eng. Rep. , vol.27 , pp. 95-141
    • Abtew, M.1    Selvaduray, G.2
  • 7
    • 0035047957 scopus 로고    scopus 로고
    • Advances in lead-free electronics soldering
    • K. Suganuma Advances in lead-free electronics soldering Curr. Opin. Solid. State Mater 5 2001 55 64
    • (2001) Curr. Opin. Solid. State Mater , vol.5 , pp. 55-64
    • Suganuma, K.1
  • 9
    • 6344292629 scopus 로고    scopus 로고
    • An overview of 4 years of kWh/kWp monitoring at 67 Sites worldwide
    • 7P-B3-03, Osaka, Japan
    • S. Ransome, J. Wohlgemuth, An overview of 4 years of kWh/kWp monitoring at 67 Sites worldwide, 3rd World Conference on Photovoltaic Energy Conference, 7P-B3-03, Osaka, Japan, 2003, pp. 22062209.
    • (2003) 3rd World Conference on Photovoltaic Energy Conference , pp. 2206-2209
    • Ransome, S.1    Wohlgemuth, J.2
  • 10
    • 0031077284 scopus 로고    scopus 로고
    • Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
    • P.L. Tu, Y.C. Chan, and J.K.L. Lai Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints IEEE Trans. Compon. Pack. B 20 1997 87 93
    • (1997) IEEE Trans. Compon. Pack. B , vol.20 , pp. 87-93
    • Tu, P.L.1    Chan, Y.C.2    Lai, J.K.L.3
  • 11
    • 0038818537 scopus 로고    scopus 로고
    • Development of CuSn intermetallic compound at Pb-free solder/Cu joint interface
    • X. Ma, F. Wang, Y. Qian, and F. Yoshida Development of CuSn intermetallic compound at Pb-free solder/Cu joint interface Mater. Lett. 57 2003 3361 3365
    • (2003) Mater. Lett. , vol.57 , pp. 3361-3365
    • Ma, X.1    Wang, F.2    Qian, Y.3    Yoshida, F.4
  • 12
    • 67349223540 scopus 로고    scopus 로고
    • The effect of temperature and solders on the wettability between ribbon and solar cell
    • H.H. Hsieh, F.M. Lin, F.Y. Yeh, and M.H. Lin The effect of temperature and solders on the wettability between ribbon and solar cell Sol. Energy Mater. Sol. Cells 93 2009 864 868
    • (2009) Sol. Energy Mater. Sol. Cells , vol.93 , pp. 864-868
    • Hsieh, H.H.1    Lin, F.M.2    Yeh, F.Y.3    Lin, M.H.4
  • 14
    • 4644338762 scopus 로고    scopus 로고
    • Phase equilibria of the AgSnCu ternary system
    • Y.-W. Yen, and S.-W. Chen Phase equilibria of the AgSnCu ternary system J. Mater. Res. 19 8 2004 2298 2305
    • (2004) J. Mater. Res. , vol.19 , Issue.8 , pp. 2298-2305
    • Yen, Y.-W.1    Chen, S.-W.2
  • 15
    • 78149361172 scopus 로고    scopus 로고
    • IEC, Photovoltaic Devices-Solar Simulator Performance Requirements, IEC 60904-9, ed. 2, 2007
    • IEC, Photovoltaic DevicesSolar Simulator Performance Requirements, IEC 60904-9, ed. 2, 2007.
  • 17
    • 0036305938 scopus 로고    scopus 로고
    • The effects of aged Cu-Al intermetallics to electrical resistance in microelectronics packaging
    • T.C. Wei, and A.R. Daud,The effects of aged CuAl intermetallics to electrical resistance in microelectronics packaging, Microelec. Int. 19(2) (2002) 38-43.
    • (2002) Microelec. Int. , vol.19 , Issue.2 , pp. 38-43
    • Wei, T.C.1    Daud, A.R.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.