-
1
-
-
0023346665
-
Tensile behavior of PbSn solder/Cu joints
-
L. Quan, D. Frear, D. Grivas, and J.W. Morris Jr. Tensile behavior of PbSn solder/Cu joints J. Electron. Mater. 16 3 1987 203 208
-
(1987)
J. Electron. Mater.
, vol.16
, Issue.3
, pp. 203-208
-
-
Quan, L.1
Frear, D.2
Grivas, D.3
Morris Jr., J.W.4
-
2
-
-
0026938523
-
Constant strain rate tensile properties of various lead based solder alloys at 0, 50 and 100 °c
-
M. Cole, and T. Caulfield Constant strain rate tensile properties of various lead based solder alloys at 0, 50 and 100 °C Scr. Metall. Mater. 27 1992 903 908
-
(1992)
Scr. Metall. Mater.
, vol.27
, pp. 903-908
-
-
Cole, M.1
Caulfield, T.2
-
3
-
-
0029389630
-
The role of CuSn intermetallics in wettability degradation
-
H.L. Reynolds, and J.W. Morris Jr. The role of CuSn intermetallics in wettability degradation J. Eletron. Mater. 24 10 1995 1429 1434
-
(1995)
J. Eletron. Mater.
, vol.24
, Issue.10
, pp. 1429-1434
-
-
Reynolds, H.L.1
Morris Jr., J.W.2
-
4
-
-
51649132316
-
Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
-
D.R. Frear, and P.T. Vianco Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys Metall. Mater. Trans. 25A 1994 1509 1523
-
(1994)
Metall. Mater. Trans.
, vol.25
, pp. 1509-1523
-
-
Frear, D.R.1
Vianco, P.T.2
-
7
-
-
0035047957
-
Advances in lead-free electronics soldering
-
K. Suganuma Advances in lead-free electronics soldering Curr. Opin. Solid. State Mater 5 2001 55 64
-
(2001)
Curr. Opin. Solid. State Mater
, vol.5
, pp. 55-64
-
-
Suganuma, K.1
-
9
-
-
6344292629
-
An overview of 4 years of kWh/kWp monitoring at 67 Sites worldwide
-
7P-B3-03, Osaka, Japan
-
S. Ransome, J. Wohlgemuth, An overview of 4 years of kWh/kWp monitoring at 67 Sites worldwide, 3rd World Conference on Photovoltaic Energy Conference, 7P-B3-03, Osaka, Japan, 2003, pp. 22062209.
-
(2003)
3rd World Conference on Photovoltaic Energy Conference
, pp. 2206-2209
-
-
Ransome, S.1
Wohlgemuth, J.2
-
10
-
-
0031077284
-
Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
-
P.L. Tu, Y.C. Chan, and J.K.L. Lai Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints IEEE Trans. Compon. Pack. B 20 1997 87 93
-
(1997)
IEEE Trans. Compon. Pack. B
, vol.20
, pp. 87-93
-
-
Tu, P.L.1
Chan, Y.C.2
Lai, J.K.L.3
-
11
-
-
0038818537
-
Development of CuSn intermetallic compound at Pb-free solder/Cu joint interface
-
X. Ma, F. Wang, Y. Qian, and F. Yoshida Development of CuSn intermetallic compound at Pb-free solder/Cu joint interface Mater. Lett. 57 2003 3361 3365
-
(2003)
Mater. Lett.
, vol.57
, pp. 3361-3365
-
-
Ma, X.1
Wang, F.2
Qian, Y.3
Yoshida, F.4
-
12
-
-
67349223540
-
The effect of temperature and solders on the wettability between ribbon and solar cell
-
H.H. Hsieh, F.M. Lin, F.Y. Yeh, and M.H. Lin The effect of temperature and solders on the wettability between ribbon and solar cell Sol. Energy Mater. Sol. Cells 93 2009 864 868
-
(2009)
Sol. Energy Mater. Sol. Cells
, vol.93
, pp. 864-868
-
-
Hsieh, H.H.1
Lin, F.M.2
Yeh, F.Y.3
Lin, M.H.4
-
14
-
-
4644338762
-
Phase equilibria of the AgSnCu ternary system
-
Y.-W. Yen, and S.-W. Chen Phase equilibria of the AgSnCu ternary system J. Mater. Res. 19 8 2004 2298 2305
-
(2004)
J. Mater. Res.
, vol.19
, Issue.8
, pp. 2298-2305
-
-
Yen, Y.-W.1
Chen, S.-W.2
-
15
-
-
78149361172
-
-
IEC, Photovoltaic Devices-Solar Simulator Performance Requirements, IEC 60904-9, ed. 2, 2007
-
IEC, Photovoltaic DevicesSolar Simulator Performance Requirements, IEC 60904-9, ed. 2, 2007.
-
-
-
-
16
-
-
78650151652
-
Light - Capturing interconnect wire for 2% module power gain
-
4CO.2.1, Hamburg, Germany
-
E.M. Sachs, J. Serdy, A.M. Gabor, and F. Van Mierlo, Light capturing interconnect wire for 2% module power gain, in: Proceedings of the 24th European Photovoltaic Solar Energy Conference and Exhibition, 4CO.2.1, Hamburg, Germany, 2009.
-
(2009)
Proceedings of the 24th European Photovoltaic Solar Energy Conference and Exhibition
-
-
Sachs, E.M.1
Serdy, J.2
Gabor, A.M.3
Van Mierlo, F.4
-
17
-
-
0036305938
-
The effects of aged Cu-Al intermetallics to electrical resistance in microelectronics packaging
-
T.C. Wei, and A.R. Daud,The effects of aged CuAl intermetallics to electrical resistance in microelectronics packaging, Microelec. Int. 19(2) (2002) 38-43.
-
(2002)
Microelec. Int.
, vol.19
, Issue.2
, pp. 38-43
-
-
Wei, T.C.1
Daud, A.R.2
|