Solder wetting measurement of back contact paste using a wetting balance

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2009, Pages 001838-001841

  Moyer, Jerome ^a   Zhang, Weiming ^a  

^a Heraeus Circuit Materials Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACK CONTACT; CRYSTALLINE SILICON SOLAR CELLS; JOINT QUALITY; SOLDER WETTING; WETTING BALANCE;

SILVER; SURFACE MOUNT TECHNOLOGY;

WETTING;

EID: 77951592892     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2009.5411516     Document Type: Conference Paper

References (3)

1. 1; D. L. King, M. Quintana, J. Kratochvil, D. Ellibee, and B. Hansen, "Photovoltaic Module Performance and Durability Following Long-Term Field Exposure", Progress in Photovoltaics: Research and Applications, Vol. 8, Issue 2, 241-256.
2. 2; G. Cuddalorepatta, J. Moyer, A. Dasgupta, S. Sealing, T. Tolliver, J. Loman, "Durability of Pb-Free Solder Connection between Copper Interconnect Wire and Crystalline Silicon Solar Cells", ITHERM '06, The Tenth Intersociety Conference, June 2 2006, 1232-1239.
3. 3; J. Moyer, W. Zhang, J. Han, X. Zhou, "High Performance Pb-free Backside Bus Bar Silver Paste for Silicon Solar Cells", SNEC PV Power Expo, 2008.