Interconnection technologies for photovoltaic modules - Analysis of technological and mechanical problems

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Volumn , Issue , 2010, Pages

  Wiese, Steffen ^a   Kraemer, Frank ^a   Betzl, Norbert ^b   Wald, Dietmar ^b  

^a FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

^b SOLARWATT AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY PROCESS; HIGH CURRENTS; HIGH-POWER; INTERCONNECTION TECHNOLOGY; LOW VOLTAGES; MECHANICAL PROBLEMS; MECHANICAL STRESS; MODULE EFFICIENCY; PHOTOVOLTAIC MODULES;

ENERGY CONVERSION; INNOVATION; MICROELECTRONICS; MICROSYSTEMS; SOLAR CELLS; SOLAR POWER GENERATION; WIRE;

STRESSES;

EID: 77953713791     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2010.5464518     Document Type: Conference Paper

References (4)

1. Mrig, L.: Photovoltaic module reliability workshop, Sheraton Inn Lakewood/Lakewood, CO, October 25-26, 1990
2. Wiese S, Meier R, Kraemer F, et al.: Constitutive Behaviour of Copper Ribbons used in Solar Cell Assembly Processes. Proc. of 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 27-29 Apri, 2009, Delft, pp. 44-51
3. Wiese, S. et al, "The effect of downscaling the dimensions of solder interconnects on their creep properties" Microelectronics Reliability, Vol. 48 (2008), pp. 843-850
4. th Electronic Components and Technology Conf, New Orleans, LA, 27-30 May 2003, pp. 197-206