The effects of temperature and solders on the wettability between ribbon and solar cell

Solar Energy Materials and Solar Cells

Volumn 93, Issue 6-7, 2009, Pages 864-868

  Hsieh, Hsin Hsin ^a   Lin, Fu Ming ^a   Yeh, Fang Yao ^a   Lin, Mei Hsiu ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Contact angle measurement; Dewetting; Lead free solders

Indexed keywords

AG SUBSTRATES; DEWETTING; EFFECTS OF TEMPERATURES; HIGH TEMPERATURES; HIGHER TEMPERATURES; LEAD SOLDERS; LEAD-FREE; LEAD-FREE SOLDERS; ROOM TEMPERATURES; SAC-SOLDERS; SESSILE DROPS; SOLDERING PROCESS; SOLDERING TEMPERATURES; WETTABILITY CHARACTERISTICS;

ANGLE MEASUREMENT; BRAZING; CONTACT ANGLE; SILVER; SOLDERING ALLOYS; SUBSTRATES; TEMPERATURE; WELDING;

LEAD;

EID: 67349223540     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2008.10.005     Document Type: Article

References (19)

1. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, NPL and ITRI Report, 1999.
2. Abtew M., and Selvaduray G. Lead-free Solders in Microelectronics. Mater. Sci. Eng. Rep. 27 (2000) 95-141
3. IPC Roadmap, A Guide for Assembly of Lead-Free Electronics, 2000.
4. Suganuma K. Advances in lead-free electronics soldering. Curr. Opin. Soled. St. M. 5 (2001) 55-64
5. Directive 2002/95/ec of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment, EC, 2003.
6. Frear D.R., and Vianco P.T. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys. Metall. Mater. Trans. 25A (1994) 1509-1523
7. Wu Y., Sees J.A., Pouraghabagher C., Foster L.A., Marshall J.L., Jacobs E.G., and Pinizzotto R.F. The formation and growth of intermetallics in composite solder. J Electron. Mater. 22 7 (1993) 769-777
8. Mei Z., Morris Jr. J.W., Shine M.C., and Summers T.S.E. Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints. J. Electron. Mater. 20 8 (1991) 599-608
9. Rönkä K.J., Van Loo F.J.J., and Kivilahti J.K. The local nominal composition-useful concept for microjoining and interconnection applications. Scripta Materialia 37 10 (1997) 1575-1581
10. Quan L., Frear D., Grivas D., and Morris Jr. J.W. Tensile Behavior of Pb-Sn solder/Cu joints J. Electron. Mater. 16 3 (1987) 203-208
11. Lee H.T., and Chen M.H. Influence of intermetallic compounds on the adhesive strength of solder joints. Mater. Sci. Eng. A 333 (2002) 24-34
12. Chen S.W., and Yen Y.W. Interfacial reactions in the Sn-Ag/Au couples. J. Electron. Mater. 30 9 (2001) 1133-1137
13. Ma X., Wang F., Qian Y., and Yoshida F. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface. Mater. Lett. 57 (2003) 3361-3365
14. Y. Zheng, C. Hillman, P. McCluskey, Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu, in: Proceedings of the 52nd Electronic Components and Technology Conference, (2002), pp. 1226-1231.
15. Tu P.L., Chan Y.C., and Lai J.K.L. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints. IEEE T. Compd. Pack. B 20 (1997) 87-93
16. Pratt R.E., Stromswold E.I., and Quensnel D.J. Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb Solder Joints. IEEE T. Compd. Pack. A 19 (1996) 134-141
17. Ma X., Qian Y.Y., and Yoshida F. Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability. J. Alloy. Compd. 334 (2002) 224-227
18. T.B. Massalski, H. Okamotom, P.R. Subramanian, L. Kacprzak, Binary Alloy Phase Diagram, ASM International, 1990.
19. Yen Y.-W., and Chen S.-W. Phase equilibria of the Ag-Sn-Cu ternary system. J. Mater. Res. 19 8 (2004) 2298-2305