Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module

Microelectronics Reliability

Volumn 52, Issue 9-10, 2012, Pages 2326-2330

  Jeong, Jae Seong ^a   Park, Nochang ^a   Han, Changwoon ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

C-SI PV MODULES; CRYSTALLINE SILICONS; DWELL TIME; EFFICIENCY DEGRADATION; FAILURE MECHANISM; FIELD FAILURE; PHYSICAL ANALYSIS; RESISTANCE CHANGE; SERIES RESISTANCES; SOLDER INTERCONNECTIONS; TEMPERATURE CYCLES; THERMAL CYCLE TESTS; WATER JETS;

CRYSTALLINE MATERIALS; ELECTRIC RESISTANCE;

SILICON;

EID: 84866743027     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.06.027     Document Type: Article

References (6)

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2. Hongtao Chen, Ling Wang, Jing Han, Mingyu Li, and Hao Liu Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress Microelectron Eng 96 2012 82 91
3. Cuddalorepatta G, Dasgupta A, Sealing S, Moyer J, Tolliver T, Loman J. Durability of Pb-free solder connection between copper interconnect wire and crystalline silicon solar cells. In: ITHERM; 2006. p. 1232-9.
4. D.L. King, M.A. Quintana, J.A. Kratochvil, D.E. Ellibee, and B.R. Hansen Photovoltaic module performance and durability following long-term field exposure Prog Photovolt: Res Appl 8 2 2000 241 256
5. Cluintana MA, King DL, McMahon TJ, Osterwald CR. Commonly observed degradation in field-aged photovoltaic modules. In: Photovoltaic specialists conference; 2002. p. 1436-9.
6. King DL et al. Dark current-voltage measurements on photovoltaic modules as a diagnostic or manufacturing tool. In: 26th IEEE PVSC proceedings; 1997. p. 1125-8.