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Volumn , Issue , 2008, Pages 102-136

Residual stresses in DLC films and adhesion to various substrates

(1)  Pauleau, Yves a  

a CNRS   (France)

Author keywords

adhesion strength; effect of process parameters; improvement of the film adhesion; magnitude of stresses; reduction of the stress level; stress modeling

Indexed keywords


EID: 84889970908     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-0-387-49891-1_4     Document Type: Chapter
Times cited : (57)

References (96)
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    • Pauleau, Y.1    Mounier, E.2    Juliet, P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.