Intermetallic evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu interface under thermal aging

Advanced Materials Research

Volumn 620, Issue , 2013, Pages 142-146

  Yahya, Iziana ^a   Ghani, Noor Asikin Ab ^a   Abiddin, Nur Nadiah Zainal ^a   Hamidi, Abd Hamid ^a   Mayappan, Ramani ^a  

^a UNIVERSITI TEKNOLOGI MARA   (Malaysia)

Author keywords

Intermetallic; Powder metallurgy and hardness; Sn Ag Cu Zn solder; X ray diffraction

Indexed keywords

BEST CHOICE; COMPOSITE SOLDERS; CU SUBSTRATE; ENVIRONMENTAL CONCERNS; HARDNESS RESULT; INTERMETALLIC FORMATION; INTERMETALLIC THICKNESS; LEAD FREE SOLDERS; LEAD-BASED SOLDERS; MICRO VICKERS HARDNESS; MICROVICKERS; RESEARCH STUDIES; SN-3.5AG; SN-AG-CU;

COPPER; ENVIRONMENTAL TECHNOLOGY; HARDNESS; INDUSTRIAL RESEARCH; INTERMETALLICS; MICROELECTRONICS; POWDER METALLURGY; SILVER; SOLDERING ALLOYS; THERMAL AGING; TIN ALLOYS; X RAY DIFFRACTION; ZINC;

TIN;

EID: 84871861957     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.620.142     Document Type: Conference Paper

References (11)

1. H. Y. Song, Q. S. Zhu, Z. G. Wang, J. K. Shang and M. Lu: Materials Science and Engineering: A Vol. 527 (2010), p.1343-1350
2. D. Q. Yu, J. Zhao and L. Wang: Journal of Alloys and Compounds Vol. 376 (2004), p. 170-175
3. F. J. Wang, Z. S. Yu and K. Qi: Journal of Alloys and Compounds Vol. 438 (2007), p. 110-115
4. M. A. A. Mohd Salleh, M. H. Z. Hazizi, Z. A. Ahmad, K. Hussin and K. R. Ahmad: Advance Material Research Vol. 277 (2011), p. 106-111
5. M. Kamal and E. Gouda: Journal of Materials Science: Materials in Electronic Vol. 19 (2008), p. 81-84
6. H. K. Kim, H. K. Liou and K. N. Tu: Applied Physics Letters Vol. 66 (1995), p. 2337-2339
7. R. Mayappan, A. B. Ismail and Z. A. Ahmad: Journal of Nuclear and related Technologies Vol. 6 (2009), p. 165-172
8. R. Mayappan: Advanced Materials Research Vol. 501 (2012), p. 150-154
9. H. R. Kotadia, O. Mokhtari, M. P. Clode, M. A. Green and S. H. Mannan: Journal of Alloys and Compounds Vol. 511 (2012), p. 176-188
10. M. G. Cho, S. K. Kang, D. Y. Shih and H. M. Lee: Journal of Electronic Materials Vol. 36 (2007), p. 1501-1509
11. S. K. Kang, D. Leonard, D. Y. Shih, L. Gignac, D. W. Henderson, S. Cho and J. Yu: Journal of Electronic Materials Vol 35 (2006), p. 479-485