Thermal probe maskless lithography for 27.5 nm half-pitch Si technology

Nano Letters

Volumn 13, Issue 9, 2013, Pages 4485-4491

  Cheong, Lin Lee ^a,b   Paul, Philip ^a,d,e   Holzner, Felix ^a,e,f   Despont, Michel ^a   Coady, Daniel J ^c   Hedrick, James L ^c   Allen, Robert ^c   Knoll, Armin W ^a   Duerig, Urs ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b USA   (United States)

^c IBM ALMADEN RESEARCH CENTER   (United States)

^d INSPIRE AG   (Switzerland)

^e SwissLitho AG   (Switzerland)

^f ETH ZURICH   (Switzerland)

Author keywords

hard mask transfer; high resolution patterning; maskless lithography; Thermal probe lithography

Indexed keywords

EXTREME ULTRAVIOLET MASKS; HARD-MASK TRANSFER; HIGH-RESOLUTION PATTERNING; LITHOGRAPHIC PATTERNS; MASK-LESS LITHOGRAPHY; PROCESS CAPABILITIES; SCANNING PROBE LITHOGRAPHY; THERMAL PROBE;

ASPECT RATIO; CARBON; SILICON;

LITHOGRAPHY;

EID: 84884237636     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl4024066     Document Type: Article

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