Ultra-thin layer packaging for implantable electronic devices

Journal of Micromechanics and Microengineering

Volumn 23, Issue 7, 2013, Pages

  Hogg, A ^a,b   Aellen, T ^b   Uhl, S ^b   Graf, B ^b   Keppner, H ^b   Tardy, Y ^c   Burger, J ^c,d  

^a UNIVERSITY OF BERN   (Switzerland)

^b UNIVERSITY OF APPLIED SCIENCES WESTERN SWITZERLAND   (Switzerland)

^c Medos International   (Switzerland)

^d UNIVERSITY OF BERN   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

FOURIER TRANSFORM INFRARED SPECTROMETRY; IMPLANTABLE ELECTRONIC DEVICES; IMPLANTABLE MEDICAL DEVICES; MATERIAL COMPOSITIONS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); PERMEATION MEASUREMENTS; THIN-FILM PACKAGING; WATER VAPOR PERMEATION;

ATOMIC FORCE MICROSCOPY; BIOCOMPATIBILITY; BIOMEDICAL EQUIPMENT; CALCIUM; ELECTROMECHANICAL DEVICES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTERFACES (MATERIALS); MEMS; MIRRORS; OPTICAL TESTING; PHOTOELECTRONS; SCANNING ELECTRON MICROSCOPY; SILICON OXIDES; THERMOELECTRIC EQUIPMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

MULTILAYERS;

EID: 84879660380     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/7/075001     Document Type: Article

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