In situ preparation and sintering of silver nanoparticles for low-cost and highly reliable conductive adhesive

International Journal of Adhesion and Adhesives

Volumn 45, Issue , 2013, Pages 138-143

  Chen, Shilong ^a   Liu, Konghua ^a   Luo, Yuanfang ^a   Jia, Demin ^a   Gao, Hong ^b   Hu, Guojun ^b   Liu, Lan ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

Adhesive; Epoxy; Silver; Sinter

Indexed keywords

CONDUCTIVE ADHESIVE; ELECTRONIC PACKAGING APPLICATIONS; EPOXY; IN-SITU PREPARATIONS; ISOTROPIC CONDUCTIVE ADHESIVES; SILVER NANOPARTICLES; SILVER NANOPARTICLES (AGNPS); SINTER;

ADHESIVES; CONTACT RESISTANCE; DECOMPOSITION; ELECTRONICS PACKAGING; ETHANOLAMINES; NANOPARTICLES; PHOTOELECTRIC DEVICES; SINTERING; TRIETHANOLAMINE;

SILVER;

EID: 84879056097     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2013.04.004     Document Type: Article

References (22)

1. D. Lu, and C.P. Wong High performance conductive adhesives IEEE Trans Electron Packag Manuf 22 1999 324 330 (Pubitemid 30559415)
2. D.D. Lu, and C.P. Wong Recent advances in developing high performance isotropic conductive adhesives J Adhes Sci Technol 22 2008 835 851
3. Y. Tao, Y.P. Xia, H. Wang, F.H. Gong, H.P. Wu, and G.L. Tao Novel isotropical conductive adhesives for electronic packaging application IEEE Trans Adv Packag 32 2009 589 592
4. S.K. Kang, and S. Purushothaman Development of conducting adhesive materials for microelectronic applications J Electron Mater 28 1999 1314 1318 (Pubitemid 32082870)
5. I. Mir, and D. Kumar Recent advances in isotropic conductive adhesives for electronics packaging applications Int J Adhes Adhes 28 2008 362 371
6. Nishikawa H, Mikami S, Terada N, Miyake K, Aoki A, Takemoto T. Electrical property of conductive adhesives using silver coated copper filler. In: Proceedings of the 2nd IEEE electronic system integration technology conference; 2008. p. 25-8.
7. X.Y. Zhu, Y.L. Liu, J.M. Long, and X.L. Liu Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives Rare Metals 31 1 2012 64 70
8. Y.S. Lin, and S.S. Chiu Electrical properties of copper-filled electrically conductive adhesives and pressure dependent conduction behavior of copper particles J Adhes Sci Technol 22 2008 1673 1697
9. S.K. Volkman, Y. Pei, D. Redinger, S. Yin, and V. Subramanian Ink-jetted silver/copper conductors for printed RFID applications J Mat Res Soc Symp Proc 814 2004 151 156 (Pubitemid 40163430)
10. K. Woo, D. Kim, J.S. Kim, S. Lim, and J. Moon Ink-jet printing of Cu-Ag-based highly conductive tracks on a transparent substrate Langmuir 25 2009 429 433
11. Y.S. Lin, and S.S. Chiu Effects of oxidation and particle shape on critical volume fractions of silver coated copper powders in conductive adhesives for microelectronic applications Polym Eng Sci 44 2004 2075 2082
12. H. Nishikawa, S. Mikami, K. Miyake, A. Aoki, and T. Takemoto Effects of silver coating covered with copper filler on electrical resistivity of electrically conductive adhesives Mater Trans 51 2010 1785 1789
13. Z. Khiati, A.A. Othman, M. Sanchez-Moreno, M.C. Bernard, S. Joiret, and E.M.M. Sutter Corrosion inhibition of copper in neutral chloride media by a novel derivative of 1,2,4-triazole Corros Sci 53 2011 3092 3099
14. G. Fonder, F. Laffineur, J. Delhalle, and Z. Mekhalif Alkanethiol-oxidized copper interface: the critical influence of concentration J Colloid Interf Sci 326 2008 333 338
15. V.S. Dilimon, J. Denayer, J. Delhalle, and Z. Mekhalif Electrochemical and spectroscopic study of the self-assembling mechanism of normal and chelating alkanethiols on copper Langmuir 28 2012 6857 6865
16. R.W. Zhang, W. Lin, K. Lawrence, and C.P. Wong Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications Int J Adhes Adhes 30 2010 403 407
17. RW Zhang, W. Lin, K.S. Moon, Q.Z. Liang, and C.P. Wong Highly reliable copper-based conductive adhesives using an amine curing agent for in situ oxidation/corrosion prevention IEEE Trans Compon Packag Manuf Technol 1 2011 25 32
18. H Gao, L. Liu, K.H. Liu, Y.F. Luo, D.M. Jia, and JS. Lu Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process J Mater Sci: Mater Electron 23 2012 22 30
19. K.H. Liu, L. Liu, Y.F. Luo, and D.M. Jia One-step synthesis of metal nanoparticle decorated graphene by liquid phase exfoliation J Mater Chem 22 2012 20342 20352
20. R.W. Zhang, K.S. Moon, W. Lin, J.C. Agar, and C.P. Wong A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications Compos Sci Technol 71 2011 528 534
21. H. Gao, L. Liu, Y.F. Luo, and D.M. Jia In-situ preparation of epoxy/silver nanocomposites by thermal decomposition of silver-imidazole complex Mater Lett 65 2011 3529 3532
22. H.Y. Liu, D. Chen, F.Q. Tang, H. Ling, and X.L. Ren Fabrication of silver nanoshells on modified polystyrene microspheres through electroless plating approach Acta Phys Chim Sin 22 2006 644 648 (Pubitemid 43774019)