Highly reliable copper-based conductive adhesives using an amine curing agent for in situ oxidation/corrosion prevention

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 1, 2011, Pages 25-32

  Zhang, Rongwei ^a,b   Lin, Wei ^a   Moon, Kyoung Sik ^a   Liang, Qizhen ^a   Wong, C P ^a,b,c  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Amine curing agent; conductive adhesives; oxidation corrosion prevention; silver coated copper

Indexed keywords

AMINE CURING; CONDUCTIVE ADHESIVE; ELECTRONIC PACKAGING APPLICATIONS; ELEVATED TEMPERATURE; HARSH ENVIRONMENT; ISOTROPICALLY CONDUCTIVE ADHESIVES; REFLOW TEMPERATURES; TERTIARY AMINE GROUPS;

COPPER; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; FILLERS; SILVER;

CURING;

EID: 84864675655     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2101870     Document Type: Article

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