Electrical property of conductive adhesives using silver-coated copper filler

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 825-828

  Nishikawa, Hiroshi ^a   Mikami, Saya ^b   Terada, Nobuto ^c   Miyake, Koich ^d   Aoki, Akira ^e   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c Harima Chemicals Inc

^d MITSUI MINING AND SMELTING CO LTD   (Japan)

^e Hikoshima Smelting Co Ltd

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; ARSENIC; COPPER; ELECTRIC PROPERTIES; FILLER METALS; HEMODYNAMICS; INDEPENDENT COMPONENT ANALYSIS; LEAD; METALS; OXIDATION; SILVER;

CONDUCTIVE ADHESIVES; CONDUCTIVE FILLERS; ELECTRICAL PROPERTIES; ELECTRICAL RESISTANCES; HIGH CONDUCTIVITIES; ISOTROPIC CONDUCTIVE ADHESIVES; LEAD-FREE SOLDERS; LOW COSTS; LOW RESISTIVITIES; METAL FILLERS; RELIABILITY TESTS;

FILLERS;

EID: 58149099882     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684458     Document Type: Conference Paper

References (8)

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