SCOPUS 정보 검색 플랫폼

Materials Transactions

Volumn 51, Issue 10, 2010, Pages 1785-1789

Effects of silver coating covered with copper filler on electrical resistivity of electrically conductive adhesives

(5) Nishikawa, Hiroshi a Mikami, Saya a Miyake, Koichi b Aoki, Akira c Takemoto, Tadashi a

a OSAKA UNIVERSITY (Japan)

b MITSUI MINING AND SMELTING CO LTD (Japan)

c Hikoshima Smelting Co Ltd (Japan)

Author keywords

Copper filler; Electrical resistivity; Electrically conductive adhesive; Oxidation; Silver coating

Indexed keywords

COMMONLY USED; CONDUCTIVE FILLERS; COPPER PARTICLES; ELECTRICAL AND THERMAL CONDUCTIVITIES; ELECTRICAL RESISTANCES; ELECTRICAL RESISTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; LOW COSTS; LOW RESISTIVITY; METAL FILLERS; POLYMERIC RESIN; PURE COPPER; RELIABILITY TEST; SILVER COATING; SILVER COATINGS;

ADHESIVES; CHEMICAL STABILITY; COATINGS; COPPER; CURING; ELECTRIC CONDUCTIVITY; FILLER METALS; METALS; OXIDATION; RESINS; SILVER; SILVER PLATING;

FILLERS;

EID: 78649378413 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.MJ201020 Document Type: Article

Times cited : (46)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.