Ink-jet printing of Cu-Ag-based highly conductive tracks on a transparent substrate

Langmuir

Volumn 25, Issue 1, 2009, Pages 429-433

  Woo, Kyoohee ^a   Kim, Dongjo ^a   Kim, Jang Sub ^b   Lim, Soonkwon ^b   Moon, Jooho ^a  

^a Yonsei University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTING POLYMERS; COPPER; INK; SUBSTRATES;

AG PARTICLES; BIMODAL PARTICLES; COMPLEX PATTERNS; CONDUCTIVE INKS; DIRECT WRITINGS; FLEXIBLE SUBSTRATES; HIGH CONDUCTIVITIES; INK-JET PRINTINGS; LOW TEMPERATURES; MAXIMUM PACKINGS; METAL FILMS; MIXED-METALS; PARTICLE PACKING DENSITIES; POLYETHER SULPHONE; TRANSPARENT PLASTICS; TRANSPARENT SUBSTRATES; VOLUME RATIOS;

SILVER;

EID: 61849086700     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la802182y     Document Type: Article

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