Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 1, 2012, Pages 22-30

  Gao, Hong ^a   Liu, Lan ^a   Liu, Konghua ^a   Luo, Yuanfang ^a   Jia, Demin ^a   Lu, Jiasheng ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BULK RESISTIVITY; CONDUCTIVE ADHESIVE; CURING PROCESS; GALVANIC CORROSION; IN-SITU; ROOM TEMPERATURE; SILVER NANOPARTICLES; SILVER NITRATES; STABILIZING AGENTS; TERTIARY AMINE;

DIAMOND CUTTING TOOLS; NANOPARTICLES; ORGANIC COMPOUNDS; SILVER ALLOYS; SINTERING; TIN;

SILVER;

EID: 84856958935     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0388-8     Document Type: Article

References (51)

1. M Inoue H Muta T Maekawa, et al. 2009 J. Electron. Mater. 38 430 10.1007/s11664-008-0593-2 1:CAS:528:DC%2BD1MXhsFOmsb8%3D
2. RW Zhang KS Moon W Lin, et al. 2010 J. Mater. Chem. 20 2018 10.1039/b921072e 1:CAS:528:DC%2BC3cXitleit7g%3D
3. Y Oh KY Chun E Lee, et al. 2010 J. Mater. Chem. 20 3579 10.1039/c0jm00086h 1:CAS:528:DC%2BC3cXmt1Smu7w%3D
4. HJ Jiang KS Moon Y Li, et al. 2006 Chem. Mater. 18 2969 10.1021/cm0527773 1:CAS:528:DC%2BD28Xktl2ns7w%3D
5. D Wakuda KS Kim K Suganuma 2008 Scr. Mater. 59 649 10.1016/j.scriptamat. 2008.05.028 1:CAS:528:DC%2BD1cXos12lsrk%3D
6. JG Bai TG Lei JN Calata, et al. 2007 J. Mater. Res. 22 3494 10.1557/JMR.2007.0440 1:CAS:528:DC%2BD2sXhsVeitrzI
7. HJ Jiang KS Moon JX Lu, et al. 2005 J. Electron. Mater. 34 1432 10.1007/s11664-005-0202-6 1:CAS:528:DC%2BD2MXht1Wru73M
8. DI Tee M Mariatti A Azizan, et al. 2007 Compos. Sci. Technol. 67 2584 10.1016/j.compscitech.2006.12.007 1:CAS:528:DC%2BD2sXlsFKqurk%3D
9. M Zhang MY Efremov F Schiettekatte, et al. 2000 Phys. Rev. B 62 10548 10.1103/PhysRevB.62.10548 1:CAS:528:DC%2BD3cXntlagu70%3D
10. AD Albert MF Becker JW Keto, et al. 2008 Acta Mater. 56 1820 10.1016/j.actamat.2007.12.034 1:CAS:528:DC%2BD1cXksFKlur8%3D
11. Z Zhang GQ Lu 2002 IEEE Trans. Electron. Pack. Manufact. 25 279 10.1109/TEPM.2002.807719 1:CAS:528:DC%2BD3sXhslGgsLc%3D
12. KS Chou KC Huang HH Lee 2005 Nanotechnology 16 779 10.1088/0957-4484/16/ 6/027 1:CAS:528:DC%2BD2MXnsl2mtrw%3D
13. P Zeng S Zajac PC Clapp, et al. 1998 Mater. Sci. Eng. A Struct. 252 301 10.1016/S0921-5093(98)00665-0
14. YG Sun YN Xia 2002 Science 298 2176 10.1126/science.1077229 1:CAS:528:DC%2BD38XpsVSkt7Y%3D
15. D Kim S Jeong J Moon 2006 Nanotechnology 17 4019 10.1088/0957-4484/17/16/ 004 1:CAS:528:DC%2BD28XhtFChs7fE
16. MN Nadagouda RS Varma 2008 Cryst. Growth Des. 8 291 10.1021/cg070473i 1:CAS:528:DC%2BD2sXhsVWqsb%2FN
17. CC Luo YH Zhang XW Zeng, et al. 2005 J. Colloid Interface Sci. 288 444 10.1016/j.jcis.2005.03.005 1:CAS:528:DC%2BD2MXkvFWmur0%3D
18. M Yamamoto Y Kashiwagi M Nakamoto 2006 Langmuir 22 8581 10.1021/la0600245 1:CAS:528:DC%2BD28XptVylt7s%3D
19. M Yamamoto M Nakamoto 2003 J. Mater. Chem. 13 2064 10.1039/b307092a 1:CAS:528:DC%2BD3sXmsFWhtr4%3D
20. M Chen YG Feng X Wang, et al. 2007 Langmuir 23 5296 10.1021/la700553d 1:CAS:528:DC%2BD2sXjvFyitrk%3D
21. YG Sun B Mayers T Herricks, et al. 2003 Nano Lett. 3 955 10.1021/nl034312m 1:CAS:528:DC%2BD3sXksVSjtrc%3D
22. DS Seo SH Park JK Lee 2009 Curr. Appl. Phys. 9 S72 10.1016/j.cap.2008.08. 011
23. A Kamyshny M Ben-Moshe S Aviezer, et al. 2005 Macromol. Rapid Commun. 26 281 10.1002/marc.200400522 1:CAS:528:DC%2BD2MXitl2rsb4%3D
24. K Cheng MH Yang WWW Chiu, et al. 2005 Macromol. Rapid Commun. 26 247 10.1002/marc.200400462 1:CAS:528:DC%2BD2MXitl2rsLY%3D
25. J Perelaer BJ de Gans US Schubert 2006 Adv. Mater. 18 2101 10.1002/adma.200502422 1:CAS:528:DC%2BD28Xptlygs7c%3D
26. I Reinhold CE Hendriks R Eckardt, et al. 2009 J. Mater. Chem. 19 3384 10.1039/b823329b 1:CAS:528:DC%2BD1MXmtFCjsrk%3D
27. YQ Fu C Shearwood B Xu, et al. 2010 Nanotechnology 21 115707 10.1088/0957-4484/21/11/115707 1:STN:280:DC%2BC3c7jtFKmug%3D%3D
28. SH Ko H Pan CP Grigoropoulos, et al. 2007 Nanotechnology 18 345202 10.1088/0957-4484/18/34/345202
29. ML Allen M Aronniemi T Mattila, et al. 2008 Nanotechnology 19 175201 10.1088/0957-4484/19/17/175201
30. D Wakuda M Hatamura K Suganuma 2007 Chem. Phys. Lett. 441 305 10.1016/j.cplett.2007.05.033 1:CAS:528:DC%2BD2sXmsFCgsro%3D
31. HH Lee KS Chou ZW Shih 2005 Int. J. Adhes. Adhes. 25 437 10.1016/j.ijadhadh.2004.11.008 1:CAS:528:DC%2BD2MXks1Wrsbo%3D
32. S Pothukuchi Y Li CP Wong 2004 J. Appl. Polym. Sci. 93 1531 10.1002/app.20626 1:CAS:528:DC%2BD2cXlvVans7s%3D
33. JX Lu KS Moon JW Xu, et al. 2006 J. Mater. Chem. 16 1543 10.1039/b514182f 1:CAS:528:DC%2BD28XjtlWntLg%3D
34. KS Moon S Liong HY Li, et al. 2004 J. Electron. Mater. 33 1381 10.1007/s11664-004-0168-9 1:CAS:528:DC%2BD2cXhtVSisLjJ
35. HY Li KS Moon CP Wong 2004 J. Electron. Mater. 33 106 10.1007/s11664-004-0278-4 1:CAS:528:DC%2BD2cXhs1Sktrs%3D
36. YG Sun YD Yin BT Mayers, et al. 2002 Chem. Mater. 14 4736 10.1021/cm020587b 1:CAS:528:DC%2BD38Xns1Sls7w%3D
37. Y Gao P Jiang L Song, et al. 2005 J. Phys. D Appl. Phys. 38 1061 10.1088/0022-3727/38/7/015 1:CAS:528:DC%2BD2MXjslalsr0%3D
38. Y Xia YJ Xiong B Lim, et al. 2009 Angew. Chem. Int. Ed. 48 60 10.1002/anie.200802248 1:CAS:528:DC%2BD1MXosFGgtQ%3D%3D
39. G. Carotenuto, L. Nicolais, B. Martorana et al., in Metal-Polymer Nanocomposite Synthesis: Novel ex situ and in situ Approaches, ed. by L. Nicolais, G. Carotenuto (Wiley, NJ, 2005), p. 176
40. JD Rancourt LT Taylor 1987 Macromolecules 20 790 10.1021/ma00170a015 1:CAS:528:DyaL2sXhsVOls7Y%3D
41. T Sawada S Ando 1998 Chem. Mater. 10 3368 10.1021/cm980051j 1:CAS:528:DyaK1cXmtF2hu78%3D
42. B Bittmann F Haupert AK Schlarb 2011 Ultrason. Sonochem. 18 120 10.1016/j.ultsonch.2010.03.011 1:CAS:528:DC%2BC3cXhtFGqsbzN
43. M Kurimoto H Okubo K Kato, et al. 2010 IEEE Trans. Dielect. El. In. 17 1268 10.1109/TDEI.2010.5539699 1:CAS:528:DC%2BC3cXhtFCqsLrM
44. DP Chen XL Qiao XL Qiu, et al. 2010 J. Mater. Sci.: Mater. Electron. 21 486 10.1007/s10854-009-9943-y 1:CAS:528:DC%2BC3cXkt1Wqsr4%3D
45. Y Oh D Suh Y Kim, et al. 2008 Nanotechnology 19 495602 10.1088/0957-4484/19/49/495602
46. Y Li KS Moon A Whitman, et al. 2006 IEEE Trans. Comp. Pack. Technol. 29 758 10.1109/TCAPT.2006.885940 1:CAS:528:DC%2BD2sXptlWgug%3D%3D
47. H. Gao, L. Liu, Y.F. Luo, et al., J. Macromol. Sci. B: Phys. accepted, (2011)
48. Y Li CP Wong 2006 Mater. Sci. Eng. R 51 1 10.1016/j.mser.2006.01.001
49. DQ Lu QK Tong CP Wong 1999 IEEE Trans. Electron. Pack. Manufact. 22 228 10.1109/6104.795858 1:CAS:528:DyaK1MXntFOkt70%3D
50. S.S. Kim, K.S. Kim, S.J. Kim et al., 50th Electronic Materials Conference (Santa Barbara, CA, 2008)
51. DQ Lu CP Wong 2000 Int. J. Adhes. Adhes. 20 189 10.1016/S0143-7496(99) 00039-1 1:CAS:528:DC%2BD3cXktVGjt7Y%3D