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Materials Transactions

Volumn 54, Issue 6, 2013, Pages 860-865

Bondability of copper joints formed using a mixed paste of Ag2O and CuO for low-temperature sinter bonding

(5) Ogura, Tomo a Yagishita, Tomohiro a Takata, Shinya a Fujimoto, Tomoyuki a Hirose, Akio a

a OSAKA UNIVERSITY (Japan)

Author keywords

Copper joint; Copper oxide; Ion migration; Nanoparticles; Silver oxide; Sintering

Indexed keywords

COPPER LAYER; COPPER NANOPARTICLES; COPPER SUBSTRATES; HIGH MELTING POINT; ION MIGRATION; LOW TEMPERATURES; POLYETHYLENE GLYCOL 400; SILVER NANOPARTICLES;

COPPER; COPPER OXIDES; ELECTRONICS PACKAGING; LEAD; NANOPARTICLES; OXIDE FILMS; OXIDES; SILVER OXIDES; SINTERING;

SILVER;

EID: 84878932693 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.MD201202 Document Type: Conference Paper

Times cited : (21)

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