Metal-metal bonding process using metallic copper nanoparticles prepared in aqueous solution

International Journal of Adhesion and Adhesives

Volumn 33, Issue , 2012, Pages 50-55

  Kobayashi, Y ^a   Shirochi, T ^a   Yasuda, Y ^b   Morita, T ^b  

^a IBARAKI UNIVERSITY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

Aqueous solution; Bonding; Colloid; Copper; Nanoparticle

Indexed keywords

AVERAGE SIZE; CETYL TRIMETHYL AMMONIUM BROMIDES; COPPER ACETATES; COPPER CHLORIDES; COPPER NITRATE; COPPER SALT; CU SUBSTRATE; HYDRAZINE CONCENTRATION; MAXIMUM VALUES; METAL-METAL BONDING; METALLIC COPPER; METALLIC CU NANOPARTICLES; REDUCING REAGENTS;

AMMONIUM COMPOUNDS; BONDING; BROMINE COMPOUNDS; CHLORINE COMPOUNDS; CITRIC ACID; COLLOID CHEMISTRY; COLLOIDS; COPPER COMPOUNDS; HYDRAZINE; METALS; NANOPARTICLES; SALTS; SOLUTIONS;

COPPER;

EID: 84855424397     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2011.11.002     Document Type: Article

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