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Volumn 50, Issue 1, 2009, Pages 226-228
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Direct bonding to aluminum with Silver-Oxide microparticles
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Author keywords
Aluminum; Bonding technique; Reduction; Silver oxide
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Indexed keywords
ACETIC ACID;
ACIDS;
ALUMINA;
ALUMINUM;
LEAD;
ORGANIC POLYMERS;
ORGANOMETALLICS;
OXIDE FILMS;
OXIDES;
PH EFFECTS;
SILVER COMPOUNDS;
TIN;
TITANIUM COMPOUNDS;
ALUMINUM SURFACES;
BONDING TECHNIQUE;
COMBUSTION HEATS;
DIRECT BONDINGS;
MICROPARTICLES;
NATURAL OXIDES;
SILVER ACETATES;
SILVER OXIDE;
SOLDER MATERIALS;
SILVER;
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EID: 60849097238
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.MRP2008277 Document Type: Conference Paper |
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Times cited : (36)
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References (7)
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