Low temperature sintering bonding process using ag nanoparticles derived from Ag2O for packaging of high-temperature electronics

Materials Science Forum

Volumn 706-709, Issue , 2012, Pages 2962-2967

  Hirose, Akio ^a   Takeda, Naoya ^a   Konaka, Yosuke ^a   Tatsumi, Hiroaki ^a   Akada, Yusuke ^a   Ogura, Tomo ^a   Ide, Eiichi ^b   Morita, Toshiaki ^b  

^a OSAKA UNIVERSITY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

Ag nanoparticles; Electronics packaging; Pb free; Sintering bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; LEAD-FREE SOLDERS; LOW TEMPERATURE OPERATIONS; METAL NANOPARTICLES; REDOX REACTIONS; SILVER OXIDES; SINTERING; TEMPERATURE;

AG NANOPARTICLE; HIGH MELTING POINT; HIGH-TEMPERATURE ELECTRONICS; LOW TEMPERATURE BONDING; LOW-TEMPERATURE SINTERING; METALLO-ORGANIC; PB-FREE; SINTERING BONDINGS;

SILVER NANOPARTICLES;

EID: 84856153863     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.706-709.2962     Document Type: Conference Paper

References (8)

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