Interfacial bonding behavior between silver nanoparticles and gold substrate using molecular dynamics simulation

Materials Transactions

Volumn 53, Issue 12, 2012, Pages 2085-2090

  Ogura, Tomo ^a   Nishimura, Masumi ^a   Tatsumi, Hiroaki ^a   Takahara, Wataru ^a   Hirose, Akio ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Epitaxial layer; Interfacial bonding; Molecular dynamics simulation; Neck growth; Silver nanoparticle

Indexed keywords

DRIVING FORCES; GOLD SUBSTRATES; GRAIN-BOUNDARY ENERGY; INTERFACIAL BONDING; INTERFACIAL BONDING BEHAVIOR; MOLECULAR DYNAMICS SIMULATIONS; NECK GROWTH; SILVER NANOPARTICLES; SINTERING BEHAVIORS; SINTERING MECHANISM; SPREADING RATE;

EPITAXIAL GROWTH; EPITAXIAL LAYERS; GOLD; GRAIN BOUNDARIES; INTERFACIAL ENERGY; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; NANOPARTICLES; REDUCTION; SINTERING; SUBSTRATES;

SILVER;

EID: 84870711903     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MB201201     Document Type: Article

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