Stress and strain evolution in electroless copper films evaluated with X-ray diffraction and substrate curvature

Journal of the Electrochemical Society

Volumn 160, Issue 6, 2013, Pages

  Sharma, Tanu ^a   Bruning, Ralf ^a   Brown, Colby ^a   Sibley, Allison ^a   Etzkorn, Johannes ^b   Stamp, Lutz ^b  

^a MOUNT ALLISON UNIVERSITY   (Canada)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BLISTER FORMATION; ELECTROLESS COPPER; ELECTROLESS COPPER PLATING; HYDROGEN EVOLUTION; PLATING BATH TEMPERATURE; SUBSTRATE BENDING; SUBSTRATE CURVATURE; THERMAL SUBSTRATES;

ADHESION; COPPER PLATING; CRYSTALLITES; DEPOSITION; INTERFACES (MATERIALS); METALLIC FILMS; X RAY DIFFRACTION;

SUBSTRATES;

EID: 84875671823     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/2.066306jes     Document Type: Article

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