Prevention of blister formation in electrolessly deposited copper film on organic substrates

Korean Journal of Chemical Engineering

Volumn 29, Issue 4, 2012, Pages 529-533

  Seo, Jung Wook ^a   Nam, Hyo Seung ^a   Lee, Seonhee ^a   Won, Yong Sun ^b  

^a Samsung Electro Mechanics   (South Korea)

^b Pukyong National University   (South Korea)

Author keywords

Adhesion; Blister; Electroless Copper Plating; Printed Wiring Board (PWB)

Indexed keywords

EID: 84859269062     PISSN: 02561115     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11814-011-0208-0     Document Type: Article

References (22)

1. T. Kobayashi, J. Kawasaki, K. Mihara and H. Honma, Electrochim. Acta, 47, 85 (2001).
2. H. Nakano, H. Suzuki, T. Haba, H. Yoshida, A. Chinda and H. Akahoshi, Elec. Comp. C., 612 (2010).
3. R. Huemoeller, S. Rusli, S. Chiang, T. Y. Chen, D. Baron, L. Brandt and B. Roelfs, Advancing Microelectronics, 34, 22 (2007).
4. D. Bhusari, H. Hayden, R. Tanikella, S. A. B. Allen and P. A. Kohl, J. Electrochem. Soc., 152, F162 (2005).
5. P. Hutapea and J. L. Grenestedt, J. Electron. Packaging, 126, 282 (2004).
6. K. G. Mishra and R. K. Parmguru, J. Electrochem. Soc., 143, 510 (1996).
7. H. H. Trieu, R. R. Chandran and R. F. Savinell, J. Electrochem. Soc., 136, 2218 (1989).
8. E. Webb, C. Witt, T. Andryuschenko and J. Reid, J. Appl. Electrochem., 34, 291 (2004).
9. W.-P. Vellinga, A. Fedorov and J. T. D. Hosson, Thin Solid Films, 517, 841 (2008).
10. R. J. Farris, J. Goldfarb and M. A. Maden, Macromol. Symp., 68, 57 (1993).
11. T. L. Aycock, N. C. Huie and G. Krauss, Metal. Mate. Trans. B, 5, 1215 (1974).
12. R. M. Rukes, Plating, 51, 1066 (1964).
13. S. Nakahara and Y. Okinaka, Acta Metall., 31, 713 (1983).
14. Y. Okinaka and S. Nakahara, J. Electrochem. Soc., 123, 475 (1976).
15. S. Nakahara and Y. Okinaka, J. Electrochem. Soc., 136, 1892 (1989).
16. J. E. A. M. van den Meerakker and J. W. G. de Bakker, J. Appl. Electrochem., 20, 85 (1990).
17. J. E. A. M. van den Meerakker, J. Appl. Electrochem., 11, 387 (1981).
18. J. E. A. M. van den Meerakker, J. Appl. Electrochem., 11, 395 (1981).
19. H. Hsu, K. Lin, S. Lin and J. Yeh, J. Electrochem. Soc., 148(1), C48 (2001).
20. A. T. Al-Mallah, S. M. El-Raghy, E. A. Abou-Saif, M. Y. Saada and A. E. El-Mahairy, Plating Surf. Finish, 67, 61 (1980).
21. G. R. Logie and A. Rantell, Trans. Inst. Met. Finish, 46, 91 (1968).
22. P. Bindra, J. M. Roldan and G. V. Arbach, IBM J. Res. Develop., 28 (1984).