The effect of nickel on the strain evolution in chemical copper films

Thin Solid Films

Volumn 520, Issue 23, 2012, Pages 6935-6941

  Bamberg, Simon ^a,c   Perry, Laura K ^b   Muir, Bruce ^b   Abuzir, Alaaedeen ^b   Brüning, Frank ^a   Brüning, Ralf ^b  

^a ATOTECH DEUTSCHLAND GMBH   (Germany)

^b MOUNT ALLISON UNIVERSITY   (Canada)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Chemical copper plating; Electroless copper plating; Sin2 psi method; Strain analysis; Stress analysis; X ray diffraction

Indexed keywords

ADVANCED APPLICATIONS; COLUMNAR STRUCTURES; COPPER FILMS; ELECTRICAL CONTACTS; ELECTRICAL INTERCONNECTS; ELECTROLESS; ELECTROLESS COPPER PLATING; ELECTRONIC COMPONENT; EXPONENTIAL RELAXATION; FILM ADHESION; FILM STRAIN; FILM STRESS; INSULATING SUBSTRATES; INTERNAL STRAINS; NICKEL ADDITION; PSI METHODS; STRAIN ANALYSIS; STRAIN EVOLUTION;

ADHESION; COPPER PLATING; ELECTROLESS PLATING; ELECTROLYTES; METALLIC FILMS; NICKEL; PALLADIUM; STRESS ANALYSIS; X RAY DIFFRACTION;

COPPER;

EID: 84865514876     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2012.07.039     Document Type: Article

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