Potential low-cost palladium-alternatives for activating electroless copper deposition

Circuit World

Volumn 36, Issue 3, 2010, Pages 4-8

  Steinhäuser, Edith ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Catalysts; Copper; Oxidation resistance

Indexed keywords

ACTIVATION PROCESS; CATALYTIC ACTIVITY; ELECTROCHEMICAL MEASUREMENTS; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; ELECTROLESS COPPER PLATING; ELECTROLESS DEPOSITION; GLYOXYLIC ACIDS; OXIDATION REACTIONS; REDUCTANTS; SELECTED METALS; THROUGH HOLE;

ACIDS; CATALYTIC OXIDATION; CHEMICAL ACTIVATION; COPPER; COPPER PLATING; CYCLIC VOLTAMMETRY; ELECTROCHEMICAL SENSORS; ELECTROLESS PLATING; ENVIRONMENTAL IMPACT; FORMALDEHYDE; METALS; OXIDATION RESISTANCE; PALLADIUM; REDUCING AGENTS;

CATALYST ACTIVITY;

EID: 78049361113     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121011066279     Document Type: Article

References (6)

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