Combining X-ray diffraction and substrate deflection analysis to understand internal stress in electroless copper films

Materials Research Society Symposium Proceedings

Volumn 1529, Issue , 2012, Pages 8-13

  Sharma, Tanu ^a   Brun̈ing, Ralf ^a   Brown, Delilah A ^a   Bamberg, Simon ^b,c   Merschky, Michael ^c   Brun̈ing, Frank ^c  

^a MOUNT ALLISON UNIVERSITY   (Canada)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLESS PLATING; METALLIC FILMS; SUBSTRATES; X RAY DIFFRACTION;

CHEMICAL FORMULATION; COMBINED STRESS; CONDUCTING LAYERS; DEFLECTION ANALYSIS; ELECTROLESS COPPER; EMERGING APPLICATIONS; INSULATING SUBSTRATES; SUBSTRATE BENDING;

INTERFACES (MATERIALS);

EID: 84900401748     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/opl.2012.1719     Document Type: Conference Paper

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