Subsurface damage distribution in silicon wafers ground with wafer rotation grinding method

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering

Volumn 49, Issue 3, 2013, Pages 88-94

  Gao, Shang ^a   Kang, Renke ^a   Dong, Zhigang ^a   Guo, Dongming ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Diamond wheel; Grinding; Silicon wafers; Subsurface damage

Indexed keywords

DEVICE WAFERS; DIAMOND WHEEL; INTEGRATED CIRCUIT MANUFACTURING; RADIAL LOCATIONS; SUB-SURFACE DAMAGE; ULTRAPRECISION GRINDING; WAFER BOW; WAFER ROTATIONS;

CRYSTAL ORIENTATION; ELECTRIC SPARKS; GRINDING (MACHINING); GRINDING MILLS; SILICON;

SILICON WAFERS;

EID: 84875331268     PISSN: 05776686     EISSN: None     Source Type: Journal    
DOI: 10.3901/JME.2013.03.088     Document Type: Article

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