Experimental investigation on the detection technique for surface layer damage of machined silicon wafers

Rengong Jingti Xuebao/Journal of Synthetic Crystals

Volumn 40, Issue 2, 2011, Pages 359-364

  Zhang, Yin Xia ^a   Li, Da Lei ^a   Gao, Wei ^a   Kang, Ren Ke ^b  

^a ZHENGZHOU UNIVERSITY   (China)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Machined damage; Measurement technique; Silicon wafers

Indexed keywords

3D SURFACE; DETECTION TECHNIQUE; DOUBLE CRYSTAL ROCKING CURVES; EXPERIMENTAL INVESTIGATIONS; HARD AND BRITTLE MATERIALS; HRXRD; MACHINED DAMAGE; MACHINED SURFACE; MEASUREMENT METHODS; MEASUREMENT TECHNIQUE; MEASUREMENT TECHNIQUES; MICRO-STRAIN; POLYCRYSTALLINE PHASIS; PREFERENTIAL ETCHING; RAMAN MICROSPECTROSCOPY; SUB-SURFACE DAMAGE; SURFACE LAYER DAMAGE; SURFACE LAYERS; TEM ANALYSIS;

AMORPHOUS MATERIALS; DAMAGE DETECTION; DISLOCATIONS (CRYSTALS); ETCHING; MICROOPTICS; RATING; SEMICONDUCTING SILICON COMPOUNDS; SURFACE DEFECTS; SURFACES;

SILICON WAFERS;

EID: 79957663469     PISSN: 1000985X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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