Improved angle polishing method for measuring subsurface damage in silicon wafers

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 27, Issue 3, 2006, Pages 506-510

  Huo, Fengwei ^a   Kang, Renke ^a   Guo, Dongming ^a   Zhao, Fuling ^a   Jin, Zhuji ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Angle polishing; Defect etching; Silicon wafer; Subsurface damage; Wedge fringes

Indexed keywords

CALCULATIONS; DEFECTS; ETCHING; POLISHING;

ANGLE POLISHING; BEVEL ANGLE; DEFECT ETCHING; DEFECT FREE WEDGE; GLUE LAYER; INTERFERENCE FRINGES; SUBSURFACE DAMAGE; WEDGE FRINGES;

SILICON WAFERS;

EID: 33745158983     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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