Nanoscale cutting of monocrystalline silicon using molecular dynamics simulation

Chinese Journal of Mechanical Engineering (English Edition)

Volumn 20, Issue 5, 2007, Pages 8-11

  Li, Xiaoping ^a   Cai, Minbo ^a   Rahman, Mustafizur ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Ductile mode cutting; Force; Molecular dynamics; Phase transformation; Stress

Indexed keywords

AMORPHOUS MATERIALS; MOLECULAR DYNAMICS; NANOTECHNOLOGY; PHASE TRANSITIONS; SEMICONDUCTING SILICON; SILICON WAFERS; STRESSES;

CHIP FORMATION ZONE; CHIP THICKNESS; CUTTING FORCES; DUCTILE MODE CUTTING; MOLECULAR DYNAMICS SIMULATION; MONOCRYSTALLINE SILICON; NANOSCALE CUTTING;

CUTTING;

EID: 35948959051     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/CJME.2007.05.008     Document Type: Article

References (7)

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