Ultra-precision grinding technology and grinder of silicon wafers

Zhongguo Jixie Gongcheng/China Mechanical Engineering

Volumn 21, Issue 18, 2010, Pages 2156-2164

  Zhu, Xianglong ^a   Kang, Renke ^a   Dong, Zhigang ^a   Guo, Dongming ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Back thinning; Grinder; Low damage grinding; Planarization; Silicon wafer; Ultra precision grinding

Indexed keywords

EID: 78049301699     PISSN: 1004132X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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