Future development on wafer planarization technology in ULSI fabrication

Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering

Volumn 39, Issue 10, 2003, Pages 100-105

  Guo, Dongming ^a   Kang, Renke ^a   Su, Jianxiu ^a   Jin, Zhuji ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Chemical mechanical polishing; IC; Planarization; Wafer

Indexed keywords

ETCHING; SILICON; SUBSTRATES; ULSI CIRCUITS;

CONTACT PLANARIZATION; ELECTROCHEMICAL MECHANICAL PLANARIZATION; PLASMA ASSISTED CHEMICAL ETCHING; STRESS FREE POLISHING; WAFER;

CHEMICAL MECHANICAL POLISHING;

EID: 1942443786     PISSN: 05776686     EISSN: None     Source Type: Journal    
DOI: 10.3901/JME.2003.10.100     Document Type: Article

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