SOI for MEMS and advanced packaging

Proceedings - IEEE International SOI Conference

Volumn , Issue , 2012, Pages

  Muldavin, Jeremy ^a   Bozler, Carl ^a   Yost, Donna ^a   Chen, Chenson ^a   Wyatt, Peter ^a  

^a MIT LINCOLN LABORATORY   (United States)

Author keywords

3DIC; flexible electronics; packaging; RF MEMS

Indexed keywords

3-D INTEGRATION; 3DIC; ADVANCED PACKAGING; BURIED OXIDES; DEVICES AND SYSTEMS; ETCH STOP; LINCOLN LABORATORY; MEMSDEVICES; RF-MEMS; SILICON LAYER; SOI CMOS;

FLEXIBLE ELECTRONICS; SILICON;

PACKAGING;

EID: 84873537439     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2012.6404402     Document Type: Conference Paper

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