Wafer-scale packaged RF microelectromechanical switches

IEEE Transactions on Microwave Theory and Techniques

Volumn 56, Issue 2, 2008, Pages 522-529

  Muldavin, Jeremy ^a,b   Bozler, Carl O ^a,b   Rabe, Steve ^a,b   Wyatt, Peter W ^a,b   Keast, Craig L ^b  

^a IEEE

^b MIT LINCOLN LABORATORY   (United States)

Author keywords

Cryogenic; Hermetic; High isolation; Micoelectromechanical (MEM); Packaging; Power handling; Radiation; Single pole four throw (SP4T); Switch

Indexed keywords

CRYOGENICS; INSERTION LOSSES; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; RADIATION EFFECTS;

POWER HANDLING; SINGLE-POLE-FOUR-THROW (SP4T);

ELECTRIC SWITCHES;

EID: 38849158472     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2007.914654     Document Type: Article

References (14)

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