High-field transport and thermal reliability of sorted carbon nanotube network devices

ACS Nano

Volumn 7, Issue 1, 2013, Pages 482-490

  Behnam, Ashkan ^a   Sangwan, Vinod K ^c   Zhong, Xuanyu ^a   Lian, Feifei ^a   Estrada, David ^a   Jariwala, Deep ^c   Hoag, Alicia J ^a   Lauhon, Lincoln J ^c   Marks, Tobin J ^c,d   Hersam, Mark C ^c,d   Pop, Eric ^a,b  

^a University of Illinois at Urbana Champaign   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c Northwestern University   (United States)

^d NORTHWESTERN UNIVERSITY   (United States)

Author keywords

carbon nanotube; electrical breakdown; infrared microscopy; nanotube junctions; network; percolation; power dissipation; thermal conductivity; ultracentrifugation

Indexed keywords

CARBON NANOTUBE NETWORK; ELECTRICAL BREAKDOWN; ELECTRICAL MEASUREMENT; FLEXIBLE SUBSTRATE; HIGH FIELD TRANSPORT; HIGH-FIELD; INFRARED MICROSCOPY; LOW THERMAL CONDUCTIVITY; METALLIC NANOTUBES; MONTE CARLO SIMULATION; NANOTUBE DENSITY; NANOTUBE JUNCTIONS; PEAK CURRENT DENSITY; PERFORMANCE LIMITS; SEMI-CONDUCTING NANOTUBES; THERMAL RELIABILITY; ULTRACENTRIFUGATION;

CARBON NANOTUBES; CENTRIFUGATION; ENERGY DISSIPATION; INFRARED IMAGING; MONTE CARLO METHODS; NANOTUBES; NETWORKS (CIRCUITS); PERCOLATION (SOLID STATE); RELIABILITY; SEMICONDUCTOR JUNCTIONS; SOLVENTS; SUBSTRATES;

THERMAL CONDUCTIVITY;

CARBON NANOTUBE;

ARTICLE; CHEMICAL MODEL; CHEMISTRY; COMPUTER SIMULATION; HEAT; THERMAL CONDUCTIVITY; ULTRASTRUCTURE;

COMPUTER SIMULATION; HOT TEMPERATURE; MODELS, CHEMICAL; NANOTUBES, CARBON; THERMAL CONDUCTIVITY;

MLCS; MLOWN;

EID: 84872874513     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn304570u     Document Type: Article

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