Interfacial thermal conductance observed to be higher in semiconducting than metallic carbon nanotubes

ACS Nano

Volumn 6, Issue 5, 2012, Pages 3853-3860

  Kang, Stephen Dongmin ^a   Lim, Seong Chu ^b   Lee, Eui Sup ^c   Cho, Young Woo ^b   Kim, Yong Hyun ^c   Lyeo, Ho Ki ^a   Lee, Young Hee ^b  

^a Korea Research Institute of Standards and Science   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Carbon nanotube; Interfacial thermal conductance; TDTR; Thermal boundary resistance; Thermal transport

Indexed keywords

AQUEOUS SUSPENSIONS; COOLING CURVE; HEAT TRANSPORT; LOW-FREQUENCY VIBRATIONAL MODES; METALLIC CARBON NANOTUBES; PACKING DENSITY; TDTR; THERMAL BOUNDARY RESISTANCE; THERMAL CONDUCTANCE; THERMAL SYSTEMS; THERMAL TRANSPORT; TRANSIENT CHANGES;

CARBON NANOTUBES; PHASE DIAGRAMS; SUSPENSIONS (FLUIDS); THERMAL CONDUCTIVITY;

SURFACE ACTIVE AGENTS;

EID: 84864705699     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn2049762     Document Type: Article

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