Acidic electroless copper deposition on aluminum-seeded ABS plastics

Surface and Coatings Technology

Volumn 203, Issue 23, 2009, Pages 3559-3568

  Li, Dapeng ^a   Yang, Chen Lu ^a  

^a UNIVERSITY OF MASSACHUSETTS DARTMOUTH   (United States)

Author keywords

ABS plastics; Adhesion; Aluminum seed; Copper deposition; Electrical conductivity

Indexed keywords

ABS PLASTIC; ABS PLASTICS; ACIDIC BATHS; ACRYLONITRILE-BUTADIENE-STYRENE; COPPER DEPOSITION; COPPER SULFATE; CU DEPOSITION; CU LAYERS; ELECTRICAL CONDUCTIVITY; ELECTROLESS; ELECTROLESS BATH; ELECTROLESS COPPER DEPOSITION; ELEVATED TEMPERATURE; ENERGY DISPERSIVE X-RAY SPECTROMETRY; ROOM TEMPERATURE; SEM;

ACIDS; ADHESION; ALUMINA; ALUMINUM; BUTADIENE; CONDUCTING POLYMERS; COPPER; COPPER PLATING; DEPOSITION; ELASTOMERS; ELECTRIC CONDUCTIVITY; NITRIC ACID; PHOSPHORIC ACID; PLASTIC PRODUCTS; PLASTICITY; SCANNING ELECTRON MICROSCOPY; STYRENE; SULFURIC ACID;

ABS RESINS;

EID: 67649313318     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.05.026     Document Type: Article

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