Evolution of stress and structure in Cu thin films

Crystal Research and Technology

Volumn 40, Issue 4-5, 2005, Pages 509-516

  Chocyk, D ^a   Zientarski, T ^b   Proszynski, A ^a   Pienkos, T ^b   Gladyszewski, L ^b   Gladyszewski, G ^a  

^a LUBLIN UNIVERSITY OF TECHNOLOGY   (Poland)

^b MARIA CURIE SK ODOWSKA UNIVERSITY   (Poland)

Author keywords

Copper; Lennard Jones fluid; Molecular dynamics simulation; Stress; Thin films

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; COPPER; CRYSTAL STRUCTURE; CRYSTALLINE MATERIALS; DEPOSITION; EVAPORATION; LATTICE CONSTANTS; MICROSTRUCTURE; MOLECULAR DYNAMICS; MORPHOLOGY; SILICON; STRESSES; SUBSTRATES; X RAY DIFFRACTION;

LENNARD-JONES FLUIDS; MOLECULAR DYNAMICS SIMULATION; SILICON SUBSTRATES; THERMAL EVAPORATION;

THIN FILMS;

EID: 25444463544     PISSN: 02321300     EISSN: None     Source Type: Journal    
DOI: 10.1002/crat.200410376     Document Type: Conference Paper

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