Surface morphology of electroless copper deposits using different reducing agents

Synthesis and Reactivity in Inorganic, Metal-Organic and Nano-Metal Chemistry

Volumn 38, Issue 3 PART 2, 2008, Pages 292-296

  Wu, Xiaomin ^a   Sha, Wei ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

Electroless copper; Glyoxylic acid; Surface morphology; Surface residual stress

Indexed keywords

EID: 48249140631     PISSN: 15533174     EISSN: 15533182     Source Type: Journal    
DOI: 10.1080/15533170802023486     Document Type: Conference Paper

References (7)

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2. C.A. Deckert, Electroless Copper Plating - A Review 2, Plat. Surf. Finish., 1995, 82, 58-64.
3. J. Darken, Printed Circuit World 5th Conv. on 'Electroless Copper - an Alternative to Formaldehyde', June 1990, Glasgow, UK, Paper B 62.
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5. Y.Y. Shacham-Diamand, Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent for Ultralarge Scale Integration Metallization, Electrochem. Solid-State Lett., 2000, 3, 279-282.
6. C.R. Shipley, Jr. 'Method of Electroless Deposition on a Substrate and Catalyst Solution Therefore'. United States Patent 3011920, 1961.
7. E.D. D'Ottavio. 'Colloidal Metal Activating Solutions for Use in Chemically Plating Non-Conductors and Process of Preparing Such Solutions'. United States Patent 3532518, 1970.