Strain analysis of copper films during wet-chemical deposition

Materials Research Society Symposium Proceedings

Volumn 1400, Issue , 2011, Pages 42-47

  Brüning, Ralf ^a   Perry, Laura K ^a   Muir, Bruce ^a   Abuzir, Alaaedeen ^a   Bamberg, Simon ^b,c   Friz, Wolfgang ^b   Dambrowsky, Nina ^b   Brüning, Frank ^b  

^a MOUNT ALLISON UNIVERSITY   (Canada)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRAIN; ELECTRICAL INTERCONNECTS; ELECTROLESS COPPER; ELECTRONIC COMPONENT; FLEXIBLE MATERIALS; INSULATING SUBSTRATES; RUTHENIUM COMPLEXES; SMOOTH SUBSTRATES;

ADHESION; COPPER; HYBRID MATERIALS; NICKEL; RUTHENIUM COMPOUNDS; SUBSTRATES; X RAY DIFFRACTION;

DEPOSITION;

EID: 84879471684     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/opl.2012.92     Document Type: Conference Paper

References (4)

1. B. Luan, X.Y. Liu, J. Nagata, and W.J. Cheong, Surface & Coatings Tech. 192, 323 (2005).
2. R. Brilning, B. Muir, E. McCalla, E. Lempereur, F. Briining and J. Etzkorn, Thin Solid Films 519, 4377 (2011).
3. rd edition (Prentice Hall, NJ, 2001).
4. E. Chason, B.W. Sheldon, L.B. Freund, J.A. Floro, SJ. Hearne, Phys. Rev. Lett. 88, 156103 (2002).